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Packing tech to drive auto MEMS sensors

Kasino im 30 Posted on Monday, July 18th, 2011 and is filed under Manufacturing. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.

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MEMS product companies have facing 3D challenges since the technology started. . For more than a decade, with traditional chip packages as the basis, MEMS technology paved the way for hermetic packaging, multidie stacking, and wafer capping, just to mention a few. These are all on track to become mature technologies.

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